Aeroflex RAD and Aeroflex RAD Europe, comprehensive radiation effects test and support laboratories, offer the following capabilities, services and standard products to HiRel, Military and Space applications.

Call: 800-645-8862

Quick-Turn Prototype IC Assembly

Quick-Turn Prototype IC Assembly

Aeroflex RAD offers the following assembly services: Quick-Turn Prototype IC Assembly in ceramic, etched out plastic, COB and flip chip.

Quick-Turn Prototype IC Assembly Capabilities:

  • Dicing, Die Visual and Die Attach
    • Wafer Dicing (up to 12inch wafers)
    • Visual Inspection (50-500X)
    • Conductive and non-conductive epoxy die attach
    • Silver Glass and Eutectic die attach
    • Flip Chip
  • Wirebond, Encapsulation and Marking
    • Gold and Aluminum Wirebond (to 35um pitch)
    • Epoxy, Solder, and Glass Frit Lid Seal
    • Dam and Fill (Plastic Encapsulation)
      • Plastic Equivalent Devices
      • COB Glob Top
    • Package Ink Marking or Laser Marking
  • Package Options
    • Multi-chip / Stacked Modules, Chip-On-Board (COB) and Custom Substrates
    • Ceramic Packages Including: BGA, PGA, J-Lead, Flat Pack, QFP, Sidebraze, Cerdip and others
    • Etched Cavity Plastic Packages Including: J-Lead, QFP, SOIC, TSSOP, QFN /MLF and others

Die / Package Thinning and Die Extraction / Repackaging

  • Die backside thinning
  • Package backside thinning to 35um ̉5um thickness
  • Die extraction and re-bonding
  • PC board design

Quality

  • DSCC MIL-STD-883 and MIL-STD-750 Laboratory Suitability
  • ISO 9001:2008 Certification

Roadmap

  • DSCC QML Cert for MIL-PRF-38535 and MIL-PRF-19500
  • AS9100 Certification

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RAD Brochure

Aeroflex RAD Brochure