HiRel Microelectronics

Standard ICs and ASICs along with Electronic Manufacturing Services (CCA, Radiation Testing, Upscreening and Packaging).

Custom Hybrid, MCM and Module Services

Providing Custom Hybrid, MCM and Module Services

Cobham Semiconductor Solutions, a supplier of standard products and custom microelectronic solutions, offers Space and Military qualified assembly and test services meeting the requirements of MIL-PRF-38534 Class H & K. In addition, our Cobham Plainview site has been accredited by the Department of Defense as a Trusted Source, Category 1A supplier for assembly services.

Our MCM packaging technology enables our customers to realize the optimum Size, Weight and Power (SWaP) of their products by applying flip-chip, chip and wire, Chip-on-Board (COB), Surface Mount Technology (SMT) and Planar Magnetics. In many cases, more than one of these technologies are combined in a single module.

From DC to 40 GHz, Cobham can provide microelectronic packaging and test solutions for high speed digital, precision analog and RF/Microwave devices used in military, space and critical industrial applications.

Product Brochures and News

  • Cobham Semiconductor Solutions is proud to announce our new, automated circuit card assembly line to help assemble your higher volumes - view our video!

EMS Brochure

Cobham Offers:

Packaged Devices with a Hybrid

Packaged Devices with a Hybrid
  • One stop solution for your microelectronic assembly, evaluation, test and screening requirements
  • MIL-PRF-38534 compliant (Class H & K), ISO9001 and AS9100 certified
  • Customer furnished tooling - Cobham is experienced in integrating customer originated designs into a smooth, seamless high quality process
  • Full turnkey and "design to spec" services for hybrid, SMT assemblies and boxes
  • Vertically integrated die to box facility, Class 1,000, Class 10,000 and Class 100,000 manufacturing space
  • High-reliability Chip-On-Board design and manufacturing services
  • RF/microwave manufacturing services for high volume phased array antennas
  • Value-added services such as radiation testing and characterization, classified testing and COTS/commercial upscreening
  • Cobham HiRel products, such as FPGAs and ASICs, are available for vertical integration

Production Capabilities:

  • State-of-the-Art gold ball bonding:
    • 0.8 mil to 2.0 mil automatic gold ball bonding
    • Typical IC bond pad dimensions: 65µm; 50µm on special request
    • Typical IC bond pad pitch: 80µm; 75µm on special request
    • Standard operating procedure: Security Bump on Stitch
    • Specialized stand-off stitch allows inter-chip, high-speed ball bonding versus slower wedge bond processes
    • Large Area - 16" x 13" bondable area

Hermetically Sealed MCM

Hermetically Sealed MCM

Hermetically Sealed Die Cavity + SMT

Hermetically Sealed Die Cavity + SMT