Aeroflex's Metelics Hi-Rel facility, in Lawrence, MA, offers JAN through JANS qualified zeners, TC zeners, hard glass switching diodes, rectifiers, current regulators, transistors and SCRs as well as JANHC and JANKC qualified chips. The facility is DLA certified to MIL-PRF-19500 and utilizes JANS certified wafer fabrication foundries.

Call: 888-641-SEMI (7364)

Statement of Compliance for Restriction of Hazardous Substances

Aeroflex / Metelics RoHS

Aeroflex / Metelics, Inc., has determined that the below listed materials are not contained in the Silicon EPI, Thin Film, and RF & Microwave Products manufactured or processed by Aeroflex / Metelics in excess of defined levels per Directive 2002/95/EC of the European Parliament and the Council of the European Union, unless required by customer specification.

  • 1: Lead, except as follows: 

    a. Lead in glass of cathode ray tubes, electronic components, and fluorescent tubes. *

    b.  Lead in high melting temperature type solders ( i.e. Sn/Pb solder alloys containing more than 85% Lead ). *

    c. When required by customer specification, external metallized contacts plated or solder dipped with alloy 2044 composed of Sn63/Pb37.

  • 2: Mercury
  • 3: Cadmium
  • 4: Hexavalent Chromium
  • 5: PBB (polybrominated biphenyl)
  • 6: PBDE (polybrominated diphenyl ether)

*  Note: Lead (Pb) content exceptions 1a and 1b listed above are exempt per the Annex listing of RoHS Directive 2002/95/EC issued and approved by the European Parliament and the Council of the European Union.

Aeroflex  / Metelics declares there is Lead (Pb) content in the ceramic glass compound utilized in the glassivation process for specific PIN, Varactor, and Monolithic wafer die.  The lead content in the ceramic glass compound is included to achieve specific performance characteristics; these specific unpackaged die components contain less than 1% by weight and individually packaged components contain less than 0.1% by weight.

Aeroflex / Metelics declares there is Lead (Pb) content in the solder preform used during the die attach process of specific glass body axial leaded semiconductor components; solder preform alloy 1027 used in the manufacture of these specific components is composed of Pb90/Sn10.
Aeroflex / Metelics is a QML-19500 supplier and declares there is Lead (Pb) content in specific qualified products as defined per MIL-PRF-19500, Appendix H.

Please contact Aeroflex / Metelics’ Quality Assurance department with requests concerning the exemptions declared in this statement of compliance as follows..

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